1.Do not put stress on the LEDs when soldering.
2.Do not warp the circuit board before it have been returned to normal ambient
conditions after soldering.
3.The temperature of the iron should be lower than 300 ℃ and soldering within
3sec per solder-pad is to be observed.
4.Caution must be used in handing this device to avoid damage to the lens
surfaces that will reduce optical efficiency.
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